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Flex-Rigid PCB |
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| Item | Technical Capacity | |
| Mass Production (MP) | Sample | |
| Types of Products | HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB, and FPC | HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB，FPC, Teflon Board, and HDI |
| Material | FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3 | FR-4,Alluminum, Non-halogen, Lead-free Compatibility ,High TG, High CTI,CEM-1,CEM-3,Teflon |
| layers | 2-12 Layers | 2-14 Layers |
| Conductor Width/ Space of the Inner Layer | 4/4mil | 4/3mil or 3/4mil |
| Conductor Width/ Space of the Outlayer Layer | 4/4mil | 4/3mil or 3/4mil |
| Board Width of the Inner Layer | 0.1-1.6mm | 0.075-1.6mm |
| Hole Diameter | 0.2mm | 0.15mm |
| Ratio of Depth against Diameter | 8:1 | 10:1 |
| Maximum Dimension | 630*530mm | 630*530mm |
| Interior Copper Width | 18-140um | 18-210um |
| Exterior Copper Width | 12-210um | 12-210um |
| Minimum Width of the Welding Ring | 0.13mm | 0.10mm |
| Minimum Width of Bridge with Solder Mask | 0.08mm | 0.05mm |
| Minimum Solder Resist Window | 0.05mm | 0.03mm |
| Tolerance of Solder Resistance | ±10% | ±8% |
| Board Thickness | 0.25mm～3.4mm | 0.25mm～3.4mm |
| Outline Process Precision | ±0.1mm | ±0.08mm |
| Surface Treatment | HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold Thickly Plated Gold Finger, Immersion Silver Thickly Plated Gold Finger | HAL, Plated Nickel/ Gold, Immersion Gold, Lead-Free Compatibility OSP, Carbon Ink, Protective Adhesive, Tin Plating ,Immersion Silver, Immersion Tin, Thickly Plated Gold Finger, Immersion Gold Thickly Plated Gold Finger, Immersion Silver Thickly Plated Gold Finger, Immersion Gold OSP |